A discrete semiconductor device, which has been cut from a Wafer but which does not include the Package. Usually a rectangular or square piece of silicon. One issue of some importance, especially when a microprocessor is intended to be included in a multi-chip (multi-die) package or in a very small device is die-size for the device, which is usually expressed in square millimeters (mm2) at a particular fabrication size (i.e., 0.37 microns, .18 microns, 90nm, 45nm).

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